Metal Bonded Dicing Saw Blade

Large Supply Various Ultra-Thin Diamond Dicing Blades ,

Resin Or Metal Bonded Diamond Cutting Blades

Blade Type: RTM1A8 Series in Various Specifications.

Image Sample Specification:

1. 76.2* 40*0.35mm

2. 58*40*0.20mm

( Diameter x Hole x Thickness )

Specification to be customized according to client's instruction.

Diamond wheel shape and indicates:

D -- Out Diameter

H -- Inner Diameter

T-- Thickness

The diamond cutting blade is especially suitable for precision cutting and slotting of optical and electronic components due to its strong holding capacity and high wear resistance to diamond abrasive particles. The products are mainly used for precision processing of optoelectronic information materials (optical glass, magnetic materials, fine ceramics, crystals, etc.).

Our company specializes in the production of ultra-thin cutting blade, diamond cutting blade, diamond saw blade and ultra-thin resin cutting wheel. The ultra-thin cutting blade has complete specifications, high quality and durability of diamond cutting blade, good quality and price of diamond saw blade. The production technology of ultra-thin resin cutting wheel is advanced,

The company can customize all kinds of products according to customers' needs, and establish detailed customer files to ensure customers' needs. Our company will strictly abide by this commitment and related contracts, fulfill the responsibilities and obligations!

Features of Diamond Blade:

• Excellent grinding ability and high wear resistance ensure long service life of the blade.

• The high hardness of the binder makes the blade have the characteristics of high rigidity, so that the blade will not deform in the cutting process, so as to ensure the perpendicularity of the cutting surface.

• Through the fine adjustment of abrasive concentration and particle size, it can meet the requirements of cutting surface finish and has good cutting efficiency.

• Advanced and scientific processing means and strict process control ensure the high accuracy of blade shape and position.

• The accurate classification of binders can meet the requirements of selecting special blades for processing different materials.

• It is suitable for single chip or multi knife combination cutting.

More Pictures of Diamond Blade:

Application of our Ultra-thin blades:

• Semiconductor, such as BGA, LGA, LED,etc.;

• Optical glass, such as filter, blue glass, crystal, gem, etc.;

• Optical communication, such as slotting-shape on quartz and cutting off quartz cover;

• Other materials, such as slotting and cutting off magnetic materials, carbide, tool steel, stainless steel.

Precautions for use:

• Please check carefully before installing the cutting wheel. If there is any gap or other damage, please stop using it.

• When the cutting wheel is marked with the rotation direction, it should be consistent with the rotation direction of the machine tool. On the contrary, the cutting is not sharp, and it is difficult to give full play to the performance of the cutting wheel.

• Please do not use the cutting wheel that does not meet the requirements.

• If any abnormality is found in the cutting process, stop the machine immediately and check the cause.

• When the cutting is not sharp, the grinding wheel should be trimmed. If it is used continuously, the grinding wheel may be damaged due to overheating and overload.

• When the grinding wheel rotates, it is strictly forbidden to cut by hand, let alone touch the sand by hand and body

• The cutting wheel is forbidden to be used in operations other than grooving or cutting, so as to avoid abnormal operation due to uneven stress.

Ordering instructions:

When you order for the first time, please provide the following parameters, so that we can help you choose the most suitable cutting wheel.

Specification and size: abrasive, particle size, binder, outer diameter, thickness, inner diameter, abrasive working layer width, substrate thickness, etc. purpose: workpiece name, cutting size, cutting material;

Service conditions of grooving and cutting: machine tool, grinding wheel speed, feed speed and cutting depth;

Dry and wet cutting requirements: cutting accuracy, chipping requirements, processing surface integrity, etc

Special requirements: whether the tool is assembled and used, whether the resin cutting wheel needs to conduct electricity, whether the outer circle of the cutting wheel has a water tank, the size and quantity of the water tank, whether there is a chip removal groove on the outer side of the cutting wheel base, etc.

Order Operating Procedure: